Fujitsu Microelectronics Limited (FML) recently announced its new mobile WiMAX chipset optimized devices such as smartphones and PDAs. Sample shipment will start in August 2008. The chipset includes a baseband LSI (MB86K22), an RF LSI (MB86K52) and a power management LSI (MB39C316). The three devices are essential elements for competitive WiMax modules and were designed so that the size of the WiMAX module will be 12x12mm. The standby current - which has a direct impact on battery life - will not exceed 0.5mA, facilitating the development of attractive mobile WiMax terminals.
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