Toshiba's 64GB NAND May Come to iPhone

Yesterday Toshiba announced the launch of its 64 GB embedded NAND flash memory module, the highest capacity achieved thus far in the industry. This new storage monster will serve as the flagship device in a line-up of six new embedded NAND flash memory modules compliant with the latest e-MMC standard. Currently Toshiba is sampling the 64 GB NAND to interested parties, and plans to kick into mass production in Q1 2010.

The new 64 GB module contains sixteen chips of 32 Gbit NAND chips (at 30 micrometers thick each) fabricated with Toshiba's 32nm process technology; there's also a dedicated controller thrown into the stack to manage basic control functions for NAND applications. Outside the 64 GB memory module, Toshiba will offer additional, smaller densities starting at 2 GB.

There's speculation that Toshiba's new 64 GB memory module may be in the next iPhone release. The press release distributed yesterday said that the module will be used in smartphones, mobile phones, netbooks, and digital video cameras. Additionally, the current iPhone 3GS includes up to 32 GB of Toshiba's NAND flash memory. AppleInsider said that Apple may offer a 128 GB iPod Touch, as the current design uses two Toshiba 32 GB NAND chips to achieve 64 GB.

Toshiba plans to ship the 16 GB version of its NAND flash memory module in Q1 2010. The 32 GB, 8 GB, and 4 GB versions will ship during Q2 2010. The 2 GB version isn't expected to ship until Q3 2010.

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  • ben850
    micro is x 10^-6 correct? so 1 micro meter = .000001 meter?
  • w4ffles
    Apple: Sweet, lets charge $600 for the next iPod Touch and $1000 for the iPhone.
  • Anonymous
    ben850, yes, micrometer is 0.000001 meter. The wafers start at around 775um, so they are backgrinding way down to get to 30um.

    I'm thinking there's something missing here with regards to future device capacity. Toshiba was a primary supplier for the 32GB Iphone with 8 32Gb chips per package on their 43nm technology. However, since a 43nm 32Gb flash is too big to fit into a standard TSOP package, Apple had to modify their board to allow Toshiba's single package to occupy the space of the traditional two TSOPs they've had in iphones.

    My point is that at 32 nm , 32 Gb fits in a TSOP, so that change alone doubles the amount of memory an iphone can carry. Throw in 16 chips per package instead of 8, and it doubles again. Could be looking at 128GB iphones in that scenario. And with 64Gb chips coming out in 2010 or early 2011, could see 256GB iphones with two 16 chip TSOP packages.