Temp 100°C 100°C 100°C 67°C 100°C 70°C Die Size 0.13 micron 0.13 micron 0.13 micron 0.13 micron 0.13 micron 0.13 micron ECC/non-ECC ECC ECC ECC ECC ECC ECC As can be seen from the technical specifications, the mobile P4-M processors we tested were...

W 0.55 W Deeper Sleep NA NA NA 0.55W 0.55 W 0.37 W Manufacturing process 0.13 micron 0.13 micron 0.13 micron 0.13 micron 0.13 micron 0.13 micron Die Size 83 mm² 83 mm² 83 mm² 83 mm² 83 mm² 83 mm² Price US $134 US $107 US $161 US $209 US $209 US...

V/ 0.956 V 1.30 V/ 1.20 V Thermal Design Power 89 W/ 35 W 81.5 W/ 19 W 81.5 W/ 19 W 24.5 W/ 6 W 35 W / 20.8 W Manufacturing process 0.13 micron 0.13 micron 0.13 micron 0.13 micron 0.13 micron Die Size 1406 mm² (size of heatspreader) 193 mm² 193 mm²...

Shader Model 3.0 Shader Model 3.0 Memory types GDDR1 DDR2 GDDR3 GDDR1 DDR2 GDDR3 GDDR1 DDR2 GDDR3 GDDR1 DDR2 GDDR3 Memory amount - max 512 MB 256 MB 512 MB 256 MB Process 0.09 micron 0.09 micron 0.11 micron 0.11 micron Nvidia is promoting the...

It took Intel a mere 15 months until Pentium 4 was finally fit for mobile devices. The first Pentium 4 core, going by the code name of 'Willamette,' was unable to meet the power and thermal requirements of a mobile environment. The 0.18 micron Willamette core...

The GeForce4 Go is built on technology that was first introduced with the GeForce4 and its NV17 core. The NV17M core that is found in GeForce4 Go is built on a 0.15 micron process, which is quite a bit more compact than the 0.18 micron process that was used...

like ATI's Mobility Radeon, is also produced using the energy-saving 0.13 micron process, whereas the FX Go5200 uses the 0.15 micron process. Thus, the NVIDIA FX Go5600 can also be operated using only 1.0 V. If the chip is put under a heavy load by a 3D application,...

• -ATI Mobility Radeon 9600