My boxed P4 D 830 (3.0 ghz 2MB/800 bus) began to die a few days ago. It always ran hot which is normal for the 1st gen Intel dualies but my box started crashing and I noticed the CPU was over 100C.

I was able to get it to run at about 65C by underclocking it to 1.5 ghz but I am getting a replacement.

So I call Intel expecting a nice easy call. The guy on the line eventually gave me an RMA but he also gave me a lot of crap when he found out that I didn't have an Intel approved case with an integrated heat pipe.

My system board runs at about 36C which is within the Intel thermal guidelines but because I didn't have a heat pipe sitting on top of the fan he was going to void my warranty.

I told him that when I purchased the boxed processor 6 months ago that nobody told me that was a requirement to use the processor. Their documentation (thank God I'm a pack rat and still had the boxed processor case and manual) says nothing about the processor requiring a heat pipe.

After a while he relented and said he would make a one time exception for me which while I appreciate it I am quite mad.

I bought a high-end dual processor that Intel knew had heat problems and spent the extra on a boxed version with a 3 year warranty and when it fails in less than 7 months (in a system that never exceeded the 38C system limit) I get crap for not knowing it had to be installed in a different case which became a requirement after I bought mine.

Anyway, they are going to replace mine but I was wondering if anyone else had problems like this with an Intel RMA.

Or could simply tell him that you were getting an AMD since they dont get as hot and don't need any fancy cooler to operate..

Maybe you would have got a nice 9XX as replacement...

I'm no expert on Intel Dual Core packaging, but I don't know of any requirement for a heat pipe. Intel stock coolers that usually ship with the 8xx is just a normal aluminum heat sink with a fan on top. The number of fins has increased for added surface area for the dual cores and the copper core is larger for better contact.

They should just look like these:
http://www.tomshardware.com/2005/0 [...] page7.html

I have no idea what they mean by a heat pipe.

They directed me to here:

http://support.intel.com/support/p [...] 012526.htm

and here:

http://support.intel.com/support/p [...] 008537.htm

Which describes what is needed to keep the case temp below 38C. With all the heat problems the Pentium D processors have had it makes sense that they would add it as a requirement because lots of folks are probably inadvertently burning out their CPU's.

I was just pissed that it burned out in less than 7 months and the support guy for making it sound like it was my fault that the processor bit the dust even though the case runs at about 36C.

I've already ordered a 930 as a replacement. Hopefully it will run a bit cooler than the 830. When I get the warranty 830 back it goes on ebay.

do the boards that support 8xx series even support the 9xx series? cause knowing Intel i wouldnt think they would? Intel's Socket370 for example - 3 diffrent revisions.

They are both 775 socket styles and my Asus board works with either.

Yep.. according to this chart you should see some improvement.. but still.. still a bit too high for my standard..

From what I have read about this most 945/955 boards will require a bios update to utilize the extra cache the 900 series chips have.

I have an Intel D945PVS board that currently has a 571J chip and I am planning on getting a 940 pressler for it, this was a concern of mine also.

But anyway.. a CPU should be running that hot first, and cooling unit should be easy to install. One company has understood that, from past experience, the other didn't and make the same mistake that the other did at one time...


First socket 462(A) AMD were running hot. The HSF would occasionnaly break the CPU or cause it to overheat if wrongly installed. Later revision of the Socket A has lowered the thermal output, but the HSF installation problems were still there. Socket 754 introduced a new way to install cooler and later revision of the Athlon 64 run very cool... This is called improvement.

OTOS, Intel has great cooler and great CPU in the Northwood time.. Now, with thermal output nearing an oven and cooler that are not really the best for the task in term of installation, this is called regression.

I'm not going to get anything yet from Intel until they put out good performance, acceptable heat output(50-55C full load max) and good pricing.

I did end up having to flash the bios to version 0606 which recognizes the 930.

After the PITA it took to get the new 930 and HSF unit seated properly I have a feeling you may be right. The temp on the 930 at idle is 38C and the motherboard is at 35C.

Quite a downturn in heat produced. Now I need something else to keep my feet warm this winter.

Your only problem is going Intel. Of course they run hot, of course Intel has a bad RMA system, and even with a 65nm 9xx chip your still sucking more juice than you should.

Personal opinion only.

That's pretty gay that they would blame you for not buying an aftermarket heatsink that wasn't absolute crap like the stock ones they give you. This is the absolute opposite of AMD-some of their stock heatsinks (particularly for high-end lines) are so well made with 4 heatpipes, copper and large surface area that they can be adequately compared with XP90C, which greatly enhanced overclocking capability as well. If I were you, I would send it back to whoever you got it from demanding a refund and switch to the X2 line as the price/performance/HEAT PROFILE totally blows away the 8XX and 9XX series. I've never dealt with AMD customer support (never had to, 3200 gets 25c on idle), but you should boycott Intel for that jerkoff who would blame you for the massive failure of the NetBurst architecture.

Please be a little more discreat about what you post.

This process should only be attempted with the mobo removed from the case, and on a surface that will give the board support. The pressure you suggest may cause damage to the motherboard, if it is in situe, inside the case.